The Company also announced that it has successfully reduced the thickness of its wafers from 200 microns in 2007 to 180 microns at the beginning of February 2008. The Company expects this reduction in wafer thickness to benefit Yingli Green Energy by reducing its polysilicon usage per watt, increasing wafer output per ingot and contributing to a reduction in cost of goods sold.

Based on its current polysilicon supply contracts and the potential higher yield in its production process from reduced wafer thickness, the Company believes it has now secured more than 70% of its expected polysilicon needs for 2008, of which the majority is virgin polysilicon.

"We are pleased to announce the reduction in our wafer thickness and that over 70% of our estimated polysilicon needs for 2008 has been contracted," commented Mr. Liansheng Miao, Chairman and Chief Executive Officer of Yingli Green Energy. "Our continued efforts to improve operating efficiencies and reduce wafer thickness have demonstrated the success of our R and D and other strategic initiatives and we believe these achievements will help us to be more competitive in 2008."

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